Standard component package outlines come from industry standard organizations that specialize in component packaging data and standardization of documents and publications. These organizations include JEDEC, EIA, IEC, NIST, IPC, ANSI, EIAJ, NEMI and JEITA.

TopLayout's default standard is IPC. Our mode of operation is to design to your standards. Your standards will be adopted and conformed so as to insure seamless interaction with your in-house resource and down-stream manufacturing. If you do not have standards, we will help guide you in the latest standards.

The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with.Every electronic component requires a solder land pattern for PCB layout. The solder pattern can be placed into two categories.
1. Meet all the industry standard requirements for the sole purpose of electronic product creation automation.
2. Fail to meet the industry standard requirements and create electronic product creation chaos.